
Cdtech TP300 Bluetooth Module

Pariview
CDI-WC46600A-01 is a Wi-Fi + BLE module independently developed by Cdtech based on the ECR6600-ATS2L chip. ECR6600-ATS2L is a SoC chip designed for smart home IoT terminal devices, supporting Wi-Fi 802.11b/g/n/ax and BLE 5.1 protocols. It includes a power management module, power amplifier, kekere-ariwo amplifier, and transceiver switch. ECR6600-ATS2L adopts a RISC processor architecture, has ample storage space, rich peripheral interfaces, a more secure encryption mechanism, an on-chip FullMAC architecture, and a wider operating temperature range.
Awọn abuda
Wi-Fi Awọn ẹya ara ẹrọ
- Supports IEEE 802.11 b/g/n/ax
- Supports Full MAC, including LMAC and UMAC
- Supports SoftAP, STA, and Wi-Fi direct connection mode
- Supports WMM QoS
- Supports 0.8/1.6/3.2 US security protection intervals
- Supports 802.11 ax MCS0 – MCS7
- The maximum bit rate reaches 150 Mbps
- Both uplink and downlink support MU-OFDMA (STA is supported)
- STA supports beamforming (STA acts as the Beamformer)
- Supports Mid-amble
- Supports 20 M and 40 M bandwidth. 802.11ax only supports 20 M bandwidth.
- Supports dual carrier modulation (Dual Carrier Modulation, DCM)
BLE Ẹya
- Supports BLE 5.1 protocol (does not support AOA/AOD)
- Supports single-device BLE connection
- Supports synchronous broadcasting and scanning
- Supports enhanced power control
- Output power up to +8 dBm
- Supports adaptive frequency hopping (AFH)
- Ṣe atilẹyin fifiranṣẹ ati gbigba data asynchronous
- Supports connection parameter update
- Supports extensible data packet length
- Ṣe atilẹyin fifi ẹnọ kọ nkan Layer ọna asopọ
- Ṣe atilẹyin LE ping
The Wi-Fi subsystem and BLE subsystem share the radio part, including ADC/DAC/PLL. Wi-Fi and BLE can only have one working at a time.
Gbogbogbo Specification
| Module awoṣe | CDI-WC46600A-01 |
| WLAN bošewa | IEEE 802.11b/g/n/ax Wi-Fi6 and BLE 5.1 |
| Main chip model | ECR6600-ATS2L |
|
Eto awose |
802.11b(DSSS):CCK(11,5.5Mbps),DQPSK(2Mbps),DBPSK(1Mb
ps) 802. 11g(OFDM):BPSK(9,6Mbps),QPSK(18, 12Mbps), 16QAM(36,24M bps),64QAM(54,48Mbps) 802. 11n(OFDM):BPSK,QPSK, 16QAM,64QAM(65Mbps) 802. 11ax(OFDMA )/64-QAM BLE(GFSKΠ/4- DQPSK 8- DPSK) |
| bandiwidi ikanni | WIFI:20 MHz/40MHz BLE:2 MHz |
|
The basic transmission rate |
WIFI 802.11b:11,5.5,2, 1 Mbps
WIFI 802. 11g:54,48,36,24, 18, 12,9,6 Mbps WIFI 802. 11n:up to 72Mbps(20MHZ);up to 150Mbps(40MHZ) WIFI 802. 11ax:up to 150Mbps(20MHZ) BLE:1 Mbps |
| Iwọn igbohunsafẹfẹ | WiFi:2400~2483.5MHZ BT: 2402~2480MHz |
|
Agbara itujade |
11b_11M:17±2dBm
11g_54M:15±2dBm 11n(20M)_MCS7:14±2dBm 11n(40M)_MCS7:13±2dBm 11ax(20M):14±2dBm BLE(1M):8±2dBm |
|
Gba ifamọ |
11b CCK11(PER<8%)< -76dBm
11g OFDM54(PER<10%) < -65dBm 11n HT20 MCS7(PER<10%) <-64dBm 11n HT40 MCS7(PER<10%) <-61dBm 11ax HT20 MCS7(PER<10%) <-52dBm BLE Receiving Sensitivity@ 1Mbit/s < -87dBm |
| Wi-Fi ni wiwo |
UART |
| Ilana ìsekóòdù | WEP/ WPA- PSK/ WPA2- PSK |
| Ipese lọwọlọwọ | Min: 500 mA |
| Ṣiṣẹ
Ibaramu otutu |
-40 ~ +85°C ibaramu otutu |
| Storage Environment temperature | -40 ~ +125°C ibaramu otutu |
| Ọriniinitutu ayika iṣẹ | 5 si 90% ti o pọju (ti kii ṣe itọlẹ) |
| PCBA iwọn | 24 x 16 x 2.2mm (LxWxH) ±0.2mm |
Pin description and PCBA size

| RARA | ORUKO | Apejuwe |
| 1 | RESET_B | EST MODE |
| 2 | GPIO23 | General-purpose GPIO |
| 3 | EN | Module Enable Pin (Requires Pull-Up) |
| 4 | GPIO22 | General-purpose GPIO |
| 5 | GPIO13 | General-purpose GPIO, UART2_TX (application port) |
| 6 | GPIO21 | General-purpose GPIO |
| 7 | GPIO25 | General-purpose GPIO |
| 8 | VCC | Module power supply (+3.3V) |
| 9 | GPIO24 | General-purpose GPIO |
| 10 | GPIO17 | General-purpose GPIO, UART2_RX (application port) |
| 11 | GPIO16 | General-purpose GPIO |
| 12 | GPIO4 | General-purpose GPIO |
| 13 | GPIO3 | SPI_MISO; General-purpose GPIO |
| 14 | GPIO2 | SPI_MISO; General-purpose GPIO |
| 15 | GND | GND |
| 16 | GPIO1 | SPI_CS; General-purpose GPIO |
| 17 | GPIO0 | SPI_CLK; General-purpose GPIO |
| 18 | GPIO20 | General-purpose GPIO |
| 19 | GPIO15 | General-purpose GPIO |
| 20 | GPIO14 | General-purpose GPIO |
| 21 | GPIO5 | General-purpose GPIO, UART0_RX (debugging port) |
| 22 | GPIO6 | General-purpose GPIO, UART0_TX (debugging port) |
Note: Method for downloading the module: VCC, GND, EN (pull-up), UART0_TX, UART0_RX, RESET_B (connected to the RTS of the serial port)
Module physical picture

Bill ti awọn ohun elo
| Atẹle olupese akojọ | |
| Orukọ ohun elo | brand olupese |
| WiFi IC | ESWIN |
| Crystal | FK,TKD,JWT,KYX |
| PCBA | A, T, P, N |
| Inductance agbara | Sunlord, CHILISIN, INPAQ, DDY |
| Agbara | SAMSUNG / EYANG |
| Atako | UniOhm /YAGEO/Walsin |
Itanna abuda
Direct-current characteristic
| Awọn ariyanjiyan | O kere ju iye | Standard awọn iye | O pọju iye | Awọn ẹya | |
| CIN Pin capacitance | 2 | pf | |||
| VIH High-level input voltage | 0.7vdd | vdd | V | ||
| VIL Low-level input voltage | 0 | 0.3vdd | |||
| IIH High-level input current | -10 | 10 | uA | ||
| IIL Low-level input current | -10 | 10 | uA | ||
| VOH High-level output voltage | 0.9vdd | V | |||
| VOL Low-level output voltage | 0. 1vdd | V | |||
| IOH Giga-ipele orisun lọwọlọwọ | 4 mA | 2 | 3.2 | 5 | mA |
| IOL Low-level sink current | 4 mA | 4 | 5.2 | 7 | mA |
| RPU Pull-up resistor | 66K | 81k | 110k | Ω | |
| RPD Pull-down resistor | 55k | 62.7k | 82.5k | Ω | |
Suggested working conditions
| Awọn ariyanjiyan | Orukọ pin | O kere ju iye | Aṣoju iye | O pọju iye | Awọn ẹya |
| Iwọn iṣẹtage | vcc-pin | 3 | 3.3 | 3.6 | V |
| Awọn iwọn otutu ti nṣiṣẹ | -40 | 85 | ℃ |
Reflow soldering curve graph
Tọkasi si boṣewa IPC/JEDEC.
- Oke otutu: <250°C
- Nọmba ti Awọn akoko: ≤2 igba

package figure

Awọn itọnisọna apoti
-
700pcs
-
Each reel is loaded with 700 pcs (leave 20 empty pockets at both the front and back without components).
-
-
Perform vacuum packaging once the taping process is complete.
-
After vacuum packaging, place the taped reel into the inner box (700 pcs total per box).
-
700pcs × 5 = 3500pcs
-
Each outer carton holds 5 inner boxes, for a total capacity of: $700\text{ pcs} \times 5 = 3500\text{ pcs}$.
-
WC46600A-01 is an ESD (Electrostatic Discharge) sensitive component. ESD or peak voltage may cause damage to the device. Although the WC46600A-01 has an internal ESD protection circuit, please handle it with care to avoid causing permanent damage or performance degradation.
Ijẹrisi
Awọn ilana iṣọpọ fun awọn aṣelọpọ ọja agbalejo ni ibamu si KDB 996369 D03 OEM Afowoyi v01r01
Akojọ ti awọn ofin FCC to wulo
CFR 47 FCC Part 15 Subpart C and Subpart C has been investigated. It is applicable to the modular transmitter.
Specific Isẹ Lilo Awọn ipo
Antenna Placement Within the Host Platform The module is tested for mobile RF exposure use condition.. The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for exampAwọn atunto kọǹpútà alágbèéká kan tabi ipo-ipo pẹlu atagba miiran), lẹhinna aṣẹ FCC ko ni ka pe o wulo ati pe ID FCC ko le ṣee lo lori ọja ikẹhin. Ni awọn ipo wọnyi, oluṣepọ OEM yoo jẹ iduro fun atunyẹwo ọja ipari (pẹlu atagba) ati gbigba aṣẹ FCC lọtọ.
Awọn ilana Module Lopin
Ko ṣiṣẹ fun
Wa kakiri Antenna Designs
Ko ṣiṣẹ fun
Awọn ero Ifihan RF
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be mobile RF exposure use condition.
Eriali Iru ati Gain
- Awọn eriali wọnyi ti ni ifọwọsi fun lilo pẹlu module yii.
- Awọn eriali ti iru kanna pẹlu ere dogba tabi isalẹ le tun ṣee lo pẹlu module yii.
- Awọn oriṣi miiran ti awọn eriali ati/tabi awọn eriali ere ti o ga julọ le nilo afikun aṣẹ fun išišẹ.
Ipari Ifitonileti Ibamu Ifamisi Ọja
When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily removed. If not, a second label must be placed on the outside of the final device that contains the following text:“Contains FCC ID:2AATP-TP300”. The FCC ID can be used only when all FCC compliance requirements are met.
Alaye lori Awọn ipo Idanwo ati Awọn ibeere Idanwo Afikun
This transmitter is tested in mobile RF exposure condition and any co-located or simultaneous transmission with other transmitter(s) class II permissive change re-evaluation or new FCC authorization. Host manufacturer installed this modular with single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C, 15.209, 15.207 requirements, only if the test result comply with FCC part 15C, 15.209, 15.207 requirement, then the host can be sold legally.
Idanwo afikun, Apá 15 Subpart B Disclaimer
This transmitter modular us tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rules requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of the rules requirements if applicable. As long as all conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this modular installed.
Alaye Afowoyi si Olumulo Ipari
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The host integrator must follow the integration instructions provided in this document and ensure that the composite system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation of the rules, including the transmitter operation, and should refer to guidance in KDB Publication 996369. OEM/Host Manufacturer Responsibilities: OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and RF Exposure essential requirements of the FCC rules
Bii o ṣe le ṣe awọn ayipada – Akọsilẹ pataki
Ti awọn ipo wọnyi ko ba le pade (fun example, awọn atunto kọǹpútà alágbèéká kan tabi ipo-ipo pẹlu atagba miiran), lẹhinna aṣẹ FCC ko jẹ pe o wulo ati ID FCC ko le ṣee lo lori ọja ikẹhin. Ni awọn ipo wọnyi, oluṣepọ OEM yoo jẹ iduro fun atunyẹwo ọja ipari (pẹlu atagba) ati gbigba aṣẹ FCC lọtọ.
Gbólóhùn FCC
Ẹrọ yii jẹ ipinnu fun awọn oluṣepọ OEM labẹ awọn ipo atẹle
- The antenna must be installed such that 20 cm is maintained between the antenna and the user.
- Module atagba le ma wa ni papọ pẹlu atagba tabi eriali miiran.
- Module Antenna Type: 2.4GHz onboard FPC Antenna, 2.68 dBi peak gain.
Ẹrọ yii ni ibamu pẹlu Apá 15 ti Awọn ofin FCC. Iṣiṣẹ jẹ koko-ọrọ si awọn ipo meji wọnyi:
- Ẹrọ yii le ma fa kikọlu ipalara.
- Ẹrọ yii gbọdọ gba kikọlu eyikeyi ti o gba, pẹlu kikọlu ti o le fa isẹ ti ko fẹ.
Akiyesi: Olufunni ko ṣe iduro fun eyikeyi awọn ayipada tabi awọn iyipada ti a ko fọwọsi nipasẹ ẹni ti o ni iduro fun ibamu. Iru awọn iyipada bẹẹ le sọ aṣẹ olumulo di ofo lati ṣiṣẹ ohun elo.
AKIYESI: Ohun elo yii ti ni idanwo ati rii lati ni ibamu pẹlu awọn opin fun ẹrọ oni nọmba Kilasi B, ni ibamu si apakan 15 ti Awọn ofin FCC. Awọn opin wọnyi jẹ apẹrẹ lati pese aabo to tọ si kikọlu ipalara ni fifi sori ibugbe kan. Ẹrọ yii n ṣe ipilẹṣẹ awọn lilo ati pe o le tan agbara ipo igbohunsafẹfẹ redio ati, ti ko ba fi sii ati lo ni ibamu pẹlu awọn ilana, o le fa kikọlu ipalara si awọn ibaraẹnisọrọ redio. Sibẹsibẹ, ko si iṣeduro pe kikọlu ko ni waye ni fifi sori ẹrọ kan pato. Ti ohun elo yii ba fa kikọlu ipalara si redio tabi gbigba tẹlifisiọnu, eyiti o le pinnu nipasẹ titan ohun elo naa ni pipa ati tan, a gba olumulo niyanju lati gbiyanju lati ṣatunṣe kikọlu naa nipasẹ ọkan tabi diẹ ẹ sii ti awọn iwọn wọnyi:
- Reorient tabi tun eriali gbigba pada.
- Mu iyatọ pọ si laarin ẹrọ ati olugba.
- So ohun elo pọ si ọna iṣan lori Circuit ti o yatọ si eyiti olugba ti sopọ.
- Kan si alagbawo oniṣowo tabi redio ti o ni iriri / onimọ-ẹrọ TV fun iranlọwọ.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The host integrator must follow the integration instructions provided in this document and ensure that the composite system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB Publication 996369.OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and RF Exposure essential requirements of the FCC rules.
Gbólóhùn Ifihan RF
Ohun elo yii ni ibamu pẹlu awọn opin ifihan itankalẹ FCC ti a ṣeto fun agbegbe ti a ko ṣakoso. Ohun elo yii yẹ ki o fi sori ẹrọ ati ṣiṣẹ pẹlu aaye to kere ju ti 20 cm laarin imooru ati ara rẹ
Awọn iwe aṣẹ / Awọn orisun
![]() | TP300 Bluetooth Module |
Awọn itọkasi
- Itọsọna olumulomanual.tools

