MICROCHIP SP1F, SP3F Power Module
Awọn pato
- Product: SP1F and SP3F Power Modules
- Awoṣe: AN3500
- Application: PCB Mounting and Power Module Mounting
Ọrọ Iṣaaju
Akọsilẹ ohun elo yii n fun awọn iṣeduro akọkọ lati sopọ ni deede si igbimọ Circuit ti a tẹjade (PCB) si SP1F tabi module agbara SP3F ki o gbe module agbara sori ẹrọ ifọwọ ooru. Tẹle awọn ilana iṣagbesori lati ṣe idinwo mejeeji gbona ati awọn aapọn ẹrọ.
PCB iṣagbesori Awọn ilana
- The PCB mounted on the power module can be screwed to the standoffs to reduce all mechanical stress and minimize relative movements on the pins that are soldered to the power module. Step 1: Screw the PCB to the standoffs of the power module.
- Pilasiti ti ara-tapering skru pẹlu iwọn ila opin ti 2.5 mm ni a ṣe iṣeduro lati so PCB naa pọ. Pilasita skru, ti o han ni nọmba atẹle, jẹ iru skru ti a ṣe apẹrẹ pataki fun lilo pẹlu ṣiṣu ati awọn ohun elo iwuwo kekere miiran. Awọn dabaru ipari da lori PCB sisanra. Pẹlu PCB ti o nipọn 1.6 mm (0.063”), lo skru plastite 6 mm (0.24”) gigun. Yiyi iṣagbesori ti o pọju jẹ 0.6 Nm (5 lbf·in). Ṣayẹwo awọn iyege ti awọn ṣiṣu post lẹhin tightening awọn skru.
- Igbesẹ 2: Solder all electrical pins of the power module to the PCB as shown in the following figure. A no-clean solder flux is required to attach the PCB, as the aqueous module cleaning is not allowed.
Akiyesi:
- Ma ṣe yiyipada awọn igbesẹ meji wọnyi, nitori ti gbogbo awọn pinni ti wa ni tita ni akọkọ si PCB, fifa PCB si awọn iduro ti o ṣẹda abuku ti PCB, ti o yori si diẹ ninu aapọn ẹrọ ti o le ba awọn orin jẹ tabi fọ awọn paati lori PCB.
- Awọn ihò ninu PCB bi o ṣe han ninu nọmba ti o ṣaju jẹ pataki lati fi sii tabi yọ awọn skru iṣagbesori ti o dabọ module agbara si ifọwọ ooru. Awọn iho iwọle wọnyi gbọdọ jẹ nla to fun ori dabaru ati awọn ifọṣọ lati kọja larọwọto, gbigba fun ifarada deede ni ipo iho PCB. Iwọn ila opin PCB fun awọn pinni agbara ni a ṣe iṣeduro ni 1.8 ± 0.1 mm. Iwọn ila opin PCB fun fifi sii tabi yiyọ awọn skru iṣagbesori ni a ṣe iṣeduro ni 10 ± 0.1 mm.
- For efficient production, a wave soldering process can be used to solder the terminals to the PCB. Each application, heat sink and PCB can be different; wave soldering must be evaluated on a case-by-case basis. In any case, a well-balanced layer of solder should surround each pin.
- The gap between the bottom of the PCB and the power module is 0.5 mm to 1 mm only as shown in PCB Mounted on Power Module figure. Using through-hole components on the PCB is not recommended.
- SP1F or SP3F pinout can change according to the configuration. See the product datasheet for more information on the pin-out location.
Power Module iṣagbesori Awọn ilana
- Iṣagbesori deede ti awo ipilẹ module sori ibi ifọwọ ooru jẹ pataki lati ṣe iṣeduro gbigbe ooru to dara. Awọn ooru rii ati awọn agbara module olubasọrọ dada gbọdọ jẹ alapin (niyanju flatness yẹ ki o wa kere ju 50 μm fun 100 mm lemọlemọfún, niyanju roughness Rz 10) ati ki o mọ (ko si dọti, ipata, tabi bibajẹ) lati yago fun darí wahala nigba ti agbara module ti wa ni agesin, ati lati yago fun ilosoke ninu gbona resistance.
- Igbesẹ 1: Ohun elo girisi gbona: Lati ṣaṣeyọri ọran ti o kere julọ si igbona igbona gbigbona, Layer tinrin ti girisi gbona gbọdọ lo laarin module agbara ati ifọwọ ooru. A gba ọ niyanju lati lo ilana titẹ iboju lati rii daju idasile aṣọ kan ti sisanra ti o kere ju ti 60 μm (2.4 mils) lori ifọwọ ooru bi o ṣe han ni nọmba atẹle. Ni wiwo gbona laarin awọn module ati awọn ooru rii le tun ti wa ni ṣe pẹlu awọn miiran conductive gbona wiwo ohun elo bi alakoso ayipada yellow (iboju-tẹ tabi alemora Layer).
- Igbesẹ 2: Iṣagbesori awọn module agbara pẹlẹpẹlẹ awọn ooru rii: Gbe awọn agbara module loke ooru rii ihò ati ki o kan kekere titẹ si o. Fi M4 dabaru pẹlu titiipa ati alapin washers ni kọọkan iṣagbesori iho (a # 8 dabaru le ṣee lo dipo M4). Ipari skru gbọdọ jẹ o kere ju 12 mm (0.5)) Ni akọkọ, rọra mu awọn skru iṣagbesori meji naa Mu ni omiiran awọn skru naa titi ti iye iyipo ipari wọn yoo de (wo iwe data ọja fun iyipo ti o pọju ti a gba laaye) O niyanju lati lo screwdriver pẹlu iyipo iṣakoso fun iṣẹ yii. atunse nigba ti kekere iye ti girisi han ni ayika awọn module agbara ni kete ti o ti wa ni mọlẹ pẹlẹpẹlẹ awọn ooru rii pẹlu awọn ti o yẹ iṣagbesori iyipo ti module gbọdọ jẹ patapata tutu pẹlu gbona girisi bi o han ni awọn girisi lori awọn Module Lẹhin Disassembling nọmba rẹ.
Apejọ Gbogbogbo View
- Ti a ba lo PCB nla kan, awọn alafo afikun laarin PCB ati ifọwọ ooru jẹ pataki. A ṣe iṣeduro lati tọju aaye ti o kere ju 5 cm laarin module agbara ati awọn alafo bi o ṣe han ni nọmba atẹle. Awọn alafo gbọdọ jẹ giga kanna bi awọn iduro (12 ± 0.1 mm).
- Fun awọn ohun elo kan pato, diẹ ninu awọn modulu agbara SP1F tabi SP3F ti ṣelọpọ pẹlu ipilẹ ipilẹ AlSiC (Aluminiomu Silicon Carbide) (suffix M ni nọmba apakan). AlSiC baseplate jẹ 0.5 mm nipon ju ipilẹ bàbà, nitorinaa awọn alafo gbọdọ jẹ 12.5 ± 0.1 mm ni sisanra.
- Iwọn fireemu ṣiṣu SP1F ati SP3F jẹ giga kanna bi SOT-227. Lori PCB kanna, ti SOT-227 ati ọkan tabi pupọ awọn modulu agbara SP1F / SP3F pẹlu ipilẹ bàbà ni a lo, ati ti aaye laarin awọn modulu agbara meji ko kọja 5 cm, ko ṣe pataki lati fi aaye naa sori ẹrọ bi o ti han ninu nọmba atẹle.
- Ti awọn modulu agbara SP1F/SP3F pẹlu AlSiC baseplate ti lo pẹlu SOT-227 tabi awọn modulu SP1F/SP3F miiran pẹlu ipilẹ bàbà, giga heatsink gbọdọ dinku nipasẹ 0.5 mm labẹ awọn modulu SP1F/SP3F pẹlu ipilẹ AlSiC lati ṣetọju gbogbo awọn iduro module ni giga kanna.
- Itọju gbọdọ wa ni ya pẹlu eru irinše bi electrolytic tabi polypropylene capacitors, Ayirapada, tabi inductor. Ti awọn paati wọnyi ba wa ni agbegbe kanna, o gba ọ niyanju lati ṣafikun awọn alafo paapaa ti aaye laarin awọn modulu meji ko kọja 5 cm iru bẹ, iwuwo ti awọn paati wọnyi lori ọkọ ko ni itọju nipasẹ module agbara ṣugbọn nipasẹ awọn spacers. Ni eyikeyi idiyele, ohun elo kọọkan, ifọwọ ooru, ati PCB yatọ; awọn spacers placers gbọdọ wa ni akojopo lori kan irú-nipasẹ-nla igba.
Power Module Dismounting Instructions
To safely remove the power module from the heatsink, perform following steps:
- On the PCB, remove all screws from the spacers.
- On the heatsink, remove all screws from the power module mounting holes.
Išọra
Depending on the thermal interface material, the module baseplates may adhere strongly to the heatsink. Do not pull on the PCB to remove the assembly, as this may damage the PCB or the modules. To prevent damage, detach each module from the heatsink before removal. - To safely detach the modules:
- Insert a thin blade, such as the tip of a flat screwdriver, between the module baseplate and the heatsink.
- Gently twist the blade to separate the baseplate from the heatsink.
- Repeat this process for each module mounted to the PCB.
Ipari
This application note gives the main recommendations regarding the mounting of SP1F or SP3F modules. Applying these instructions helps decrease the mechanical stress on PCB and power module, while ensuring long term operation of the system. Mounting instructions to the heatsink must also be followed to achieve the lowest thermal resistance from the power chips down to the cooler. All these steps are essential to guarantee the best system reliability.
Àtúnyẹwò History
Itan atunyẹwo ṣe apejuwe awọn iyipada ti a ṣe imuse ninu iwe-ipamọ naa. Awọn iyipada ti wa ni atokọ nipasẹ atunyẹwo, bẹrẹ pẹlu atẹjade lọwọlọwọ julọ.
| Àtúnyẹwò | Ọjọ | Apejuwe |
| B | 10/2025 | Fi kun Power Module Dismounting Instructions. |
| A | 05/2020 | Eyi ni itusilẹ akọkọ ti iwe yii. |
Microchip Alaye
Awọn aami-išowo
- Orukọ “Microchip” ati aami, aami “M”, ati awọn orukọ miiran, awọn aami, ati awọn ami iyasọtọ ti forukọsilẹ ati awọn aami-išowo ti ko forukọsilẹ ti Microchip Technology Incorporated tabi awọn alafaramo ati/tabi awọn ẹka ni Amẹrika ati/tabi awọn orilẹ-ede miiran (“Microchip). Awọn aami-išowo"). Alaye nipa Awọn aami-išowo Microchip le rii ni https://www.microchip.com/en-us/about/legal-information/microchip-trademarks.
- ISBN: 979-8-3371-2109-3
Ofin Akiyesi
- Atẹjade yii ati alaye ti o wa ninu rẹ le ṣee lo pẹlu awọn ọja Microchip nikan, pẹlu lati ṣe apẹrẹ, idanwo, ati ṣepọ awọn ọja Microchip pẹlu ohun elo rẹ. Lilo alaye yii ni ọna miiran ti o lodi si awọn ofin wọnyi. Alaye nipa awọn ohun elo ẹrọ ti pese fun irọrun rẹ nikan ati pe o le rọpo nipasẹ awọn imudojuiwọn. O jẹ ojuṣe rẹ lati rii daju pe ohun elo rẹ ni ibamu pẹlu awọn pato rẹ. Kan si ọfiisi tita Microchip agbegbe rẹ fun atilẹyin afikun tabi, gba atilẹyin afikun ni www.microchip.com/en-us/support/design-help/client-support-services.
- ALAYE YI NI MICROCHIP “BI O SE WA”. MICROCHIP KO SE Aṣoju TABI ATILẸYIN ỌJA TI IRU KANKAN BOYA KIAKIA TABI TỌRỌ, KỌ TABI ẹnu, Ilana tabi Bibẹkọkọ, ti o jọmọ ALAYE NAA SUGBON KO NI LOPIN SI KANKAN, LATI IKILỌ ỌRỌ, ÀTI IFỌRỌWỌRỌ FUN IDI PATAKI, TABI ATILẸYIN ỌJA TO JEmọ MAJEMU, Didara, TABI Iṣe Rẹ.
LAISI iṣẹlẹ ti yoo ṣe oniduro fun eyikeyi aiṣedeede, PATAKI, ijiya, ijamba, tabi ipadanu, bibajẹ, iye owo, tabi inawo ti eyikeyi iru ohunkohun ti o jọmọ si awọn alaye tabi ti o ti gba, ti o ba ti lo, Ti a gbaniyanju nipa Seese TABI awọn bibajẹ ni o wa tẹlẹ. SI AWỌN NIPA NIPA NIPA TI OFIN, LAPAPA LAPAPO MICROCHIP LORI Gbogbo awọn ẹtọ ni eyikeyi ọna ti o jọmọ ALAYE TABI LILO RE KO NI JU OPO ỌWỌ, TI O BA KAN, PE O TI ṢAN NIPA TODAJU SIROMỌ. - Lilo awọn ẹrọ Microchip ni atilẹyin igbesi aye ati/tabi awọn ohun elo aabo jẹ patapata ni ewu olura, ati pe olura gba lati daabobo, ṣe idalẹbi ati dimu Microchip ti ko lewu lati eyikeyi ati gbogbo awọn bibajẹ, awọn ẹtọ, awọn ipele, tabi awọn inawo ti o waye lati iru lilo. Ko si awọn iwe-aṣẹ ti a gbe lọ, laisọtọ tabi bibẹẹkọ, labẹ eyikeyi awọn ẹtọ ohun-ini imọ Microchip ayafi bibẹẹkọ ti sọ.
Ẹya Idaabobo koodu Awọn ẹrọ Microchip
Ṣe akiyesi awọn alaye atẹle ti ẹya aabo koodu lori awọn ọja Microchip:
- Awọn ọja Microchip pade awọn pato ti o wa ninu Iwe Data Microchip pato wọn.
- Microchip gbagbọ pe ẹbi ti awọn ọja wa ni aabo nigba lilo ni ọna ti a pinnu, laarin awọn pato iṣẹ, ati labẹ awọn ipo deede.
- Awọn iye Microchip ati ibinu ṣe aabo awọn ẹtọ ohun-ini ọgbọn rẹ. Awọn igbiyanju lati irufin awọn ẹya aabo koodu ti awọn ọja Microchip jẹ eewọ muna ati pe o le rú Ofin Aṣẹ-lori Ẹgbẹrun Ọdun Digital.
- Bẹni Microchip tabi eyikeyi olupese semikondokito miiran le ṣe iṣeduro aabo koodu rẹ. Idaabobo koodu ko tumọ si pe a n ṣe iṣeduro ọja naa jẹ “aibikita”. Idaabobo koodu ti wa ni idagbasoke nigbagbogbo. Microchip ti pinnu lati ni ilọsiwaju nigbagbogbo awọn ẹya aabo koodu ti awọn ọja wa.
FAQ
Can I use a wave soldering process for soldering terminals to the PCB?
Yes, a wave soldering process can be used for efficient production. However, evaluate its suitability based on your specific application, heat sink, and PCB requirements.
Is it necessary to install a spacer between power modules?
If the distance between two power modules does not exceed 5 cm and they are mounted on the same PCB with a SOT-227, it is not necessary to install a spacer.
Awọn iwe aṣẹ / Awọn orisun
 |
MICROCHIP SP1F, SP3F Power Module [pdf] Ilana itọnisọna SP1F, SP3F, AN3500, SP1F SP3F Power Module, SP1F SP3F, Power Module, Module |